3D-Micromac announced that a leading optical solutions provider has purchased several microMIRA laser lift-off (LLO) systems to use in the production of microLED devices. The systems will be installed in pilot lines and production lines at its state-of-the-art LED chip factory in Asia
3D-Micromac says that the microMIRA laser system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer's unique requirements. The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.
3D-Micromac has sold more than 10 laser processing systems for microLED applications to date, including the industry-benchmark microMIRA laser-lift-off system as well as its recently introduced microCETI micromachining platform.
