Technical / research

Researchers from Hunan University have designed and grown wafer-scale uniform green GaN epilayer on silicon wafers (4-inch and 6-inch in size). The epilayer was of very high uniformity and showed excellent properties. Using this wafer, the researchers developed green microLED displays reaching over 10 million nits.

This epilayer demonstrated a low dislocation density of 5.25×108 cm^-2, minimal wafer bowing of 16.7 μm, and high wavelength uniformity (STDEV<1 nm). The researcher integrated the Micro-LEDs with CMOS circuits and created 1080x780 monochrome green microLED displays, which offered the ultra high brightness.

Researchers from Korea's Kookmin University in collaboration with colleagues from Kyung Hee University have managed to enhance the performance of microLEDs produced using fluidic self-assembly based on chelation bonds of chemical linkers. The researcher report up to 61.8% increase in assembly yield compared to previous methods, and their vertically assembled 1.3 um microLEDs achieved a peak EQE of 8.1% and a brightness of 22,300 nits at 9 V.

The researcher developed a novel approach for the face-selective vertical assembly of microLEDs using a chemical linker capable of engaging in metal chelate coordination interactions within Zn metal complexes.

Researchers from Cornell University, in collaboration with researchers from the Polish Academy of Science have developed the world's first chip that combines an LED and a transistor. This so-called Dualtronic chip could pave the way towards smaller, lower-cost and more efficient LEDs. 

The researchers built their GaN device so that on one side it has a high electron mobility transistor (HEMT), and on the other side it has an LED. The researchers take advantage of a unique property of GaN - the fact that it has a large electronic polarization along its crystal axis, which gives each of its surfaces dramatically different physical and chemical properties. The gallium side is useful for photonic devices, while the Nitrogen side is useful for transistor devices.

On September 24-26, the inaugural MicroLED-Connect event took place in Eindhoven, The Netherlands. It was an extremely successful event with attendees, speakers and exhibitors from all over the world there to discuss the latest microLED innovations and updates. It is clear that there's much interest and driving force behind the microLED industry.

MicroLED-Connect hosted over 40 speakers and 8 masterclasses, providing a wealth of information by leading display makers and supply chain companies, researchers, material makers, market analysts, investors, application developers, and more. The agenda included speakers from Google, Meta, TCL CSoT, KAUST, JCDecaux, CEA/Leti, GlobalFoundries, Aixtron, Continental, Applied Materials, imec.Xpand, VueReal, ALLOS and many more.

You can now access all of the event recordings (and proceedings), in addition to recordings and presentations from past microLED-Connect virtual events. MicroLED-Connect offers yearly passes to access all of the content, in addition to online access to events during the year.

Researchers from the University of Illinois Urbana-Champaign developed a new process to create transistors for high-performance microLED displays. The researchers say that this is the highest performing solution-processed semiconductor transistor to date, and a potential low-cost one.

The new method is based on ordered defect compound semiconductor CuIn5Se8 prepared by solution deposition. These transistors were used to form high-speed logic circuits operating in megahertz, to power a small 508 PPI blue microLED display (8 micron LEDs).

OTFT developer Smartkem, a MicroLED Industry Association member, announced that it has signed an agreement with Shanghai Chip Foundation Semiconductor Technology to co-develop microLED-based backlight units for LCD displays.

Smartkem prototype microLED display

The new backlight units will use Smartkem's proprietary organic dielectric single layer material, or Redistribution Layer (RDL). Chip Foundatiion will use the material with its own microLED devices. As part of the co-development project, Smartkem will develop specifica insulator materials to be used by Chip Foundation. The project will develop miniLED packages that contain four microLEDs wired in series. Smartkem says that the chip will offer high brightness, high current efficiency, improved uniformity and lower power consumption compared to current miniLED based backlighting units.

Researchers from Zhengzhou University, the Zhengzhou University of Railway Engineering and North Minzu University has developed a new method to improve the efficiency of deep ultraviolet (DUV) microLEDs.

The researchers explain that standard DUV microLEDs suffers from serious electron leakage, and low hole injection efficiency. And the smaller they get, the more sidewall defects reduce the efficiency even further. The researchers introduced polarized bulk charges into the hole supply layer and the electron  supply layer (p-HSL and n-ESL) to enhance the binding of carriers and increase the injection efficiency of carriers.

MicroLED-Connect is the world's first dedicated MicroLED conference and exhibition. The event, organized by TechBlick and the MicroLED Association, will take place at the High Tech Campus in Eindhoven, also known as "the smartest square kilometer in all of Europe", and will include an excellent conference program, masterclasses, tours - with a special emphasis on social/professional gatherings and networking opportunities. Register now to attend MicroLED-Connect and enjoy our special discount (up to 400 per ticket), valid until August 15, of up to 400 Euro.

One of the themes to be highlighted at the event is microLED material platforms, the basis of all microLED emission technology. As MicroLED technology competes with high-end and cost-effective OLED displays, microLED developers need to deeply innovate their material platforms and technologies and we believe that this is one of the keys for microLEDs' future success.

Researchers from HP propose a new composable monitor design - that is based on microLED display modules (tiles) that can connect together to construct complete monitors. The researchers explain that microLED is a key technology as it enables a bezel-less design.

The main idea is to create Lego-like building blocks, both flat and curved, that can connect in both horizontal and vertical configurations.