Pyramidical GaN microLED developer Polar Light Technologies announce a partnership with die bonding solution developer Finetech, to co-develop microLED technologies. The two companies already started developing microLED microdisplay applications.
Polar Light Technologies and Finetech developed a modified flip-chip cold bonding technique that ensures accurate alignment between the microLEDs and the electronics. The two companies say that in early trials, this method showed an impressive 85% success rate, proving its potential for large-scale manufacturing.
Polar Light produces its microLEDs using ALD on silicon carbide. Because of differences in how silicon carbide and silicon (the final display substrate) expand with heat, no heat could be used during the bonding process. Finetech and Polar Light Technologies developed a cold compression bonding method for aligning and bonding MicroLED arrays using an automated FINEPLACER femto 2 sub-micron die bonder.
Both companies are set to present their latest innovations aimed at advancing microLED display technology next week at MicroLED-Connect 2024. Finetech will also exhibit and showcase its microLED solutions (booth #4).
