Tianma shares details on its microLED production process, developed a new side wiring deposition technology to reduce costs
Tianma Microelectronics announced that it has developed a new side wiring technology that enables completely seamless tiled microLED displays. The new technology is based on a new process that is much more cost effective compared to other processes, in fact Tianma says it can reduce the cost of side wiring deposition by up to three times.
Tianma shared some details about its first tiled microLED displays. These offer a very small pixel pitch of 0.4 mm, and are based on an LTPS backplane. Tianma also revealed that it is using a laser-bsaed transfer process. The company is now running trial production, and it hopes to improve the yields and production efficiency in 2025, and then move to small batch mass production.