Tianma shares details on its microLED production process, developed a new side wiring deposition technology to reduce costs

Tianma Microelectronics announced that it has developed a new side wiring technology that enables completely seamless tiled microLED displays. The new technology is based on a new process that is much more cost effective compared to other processes, in fact Tianma says it can reduce the cost of side wiring deposition by up to three times.

Tianma shared some details about its first tiled microLED displays. These offer a very small pixel pitch of 0.4 mm, and are based on an LTPS backplane. Tianma also revealed that it is using a laser-bsaed transfer process. The company is now running trial production, and it hopes to improve the yields and production efficiency in 2025, and then move to small batch mass production.

 

In June 2022, Tianma Microelectronics announced plans to establish a $164 million full-process microLED pilot line, in Xiamen, and later in 2024 Tianma said that the production line has commenced trial production. The first display produced in the new line, it was reported, is a 7.5" module aimed towards tiled displays, that offers a brightness of 600 nits and a low 5% reflectance. 

In May 2024, Tianma demonstrated several MicroLEDs prototypes at Displayweek 2024, including automotive displays, transparent displays, and wearable ones.

Posted: Nov 14,2024 by Ron Mertens