Kyoreca developed a new process to grow low-defect microLED GaN devices
Kyocera Corporation announced that it has successfully developed a new process technology to produce microLED (and micro-laser) devices. The process is based on lateral growth of GaN layer on a silicon wafer, in a way that limits defects in most of the area.
The basic process has three steps. First you grow a GaN layer on silicon. The second step is to apply a mask with a has a horizontal gap. The third step is to continue growing the GaN layer. The defects are concentrated in the opening nucleus, but the rest of the growth area remains almost defect free. The actual microLED devices are fabricated from the low-defect region.