DELO shows that conductive adhesives could replace soldering in microLED displays and help to increase production yields
Adhesive developer and MicroLED Association member DELO has conducted in-house feasibility studies, that shows that their directional conductive adhesives can be used to replace soldering in miniLED, and microLED displays. The bonding was found to be reliable with high yields.
DELO says that current microLED displays use solder materials to interconnect the LEDs to the display backplane. But as chip size gets smaller, isotopic conductive materials (like solder) is not reliable as it is difficult to avoid short circuits, and so production yields suffer.